We are experienced in handling a wide range of advanced assembly requirements. Our capabilities include:
SMT and through-hole
High speed placement
BGA and Micro-BGA
0.3mm fine pitch IC's
01005 placement
AOI board inspection
Customized reflow profiling
Prototype quick-turn assembly
Production volumes with scheduled deliveries
Double side boards
Conformal coating
Firmware programming
Functional testing
RoHS compliant process
IPC certified
Workmanship guarantee
See something you need that's not on this list? Get in touch!