We are experienced in handling a wide range of advanced assembly requirements. Our capabilities include:

  • SMT and through-hole

  • High speed placement

  • BGA and Micro-BGA

  • 0.3mm fine pitch IC's

  • 01005 placement

  • AOI board inspection

  • Customized reflow profiling

  • Prototype quick-turn assembly

  • Production volumes with scheduled deliveries

  • Double side boards

  • Conformal coating

  • Firmware programming

  • Functional testing

  • RoHS compliant process

  • IPC certified

  • Workmanship guarantee

See something you need that's not on this list? Get in touch!

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