We are experienced in handling a wide range of advanced assembly requirements. Our capabilities include:

  • SMT and through-hole
  • High speed placement
  • BGA and Micro-BGA
  • 0.3mm fine pitch IC's
  • 01005 placement
  • AOI board inspection
  • Customized reflow profiling
  • Prototype quick-turn assembly
  • Production volumes with scheduled deliveries
  • Double side boards
  • Conformal coating
  • Firmware programming
  • Functional testing
  • RoHS compliant process
  • IPC certified
  • Workmanship guarantee

See something you need that's not on this list? Get in touch!

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