Our assembly capabilities

We are experienced in handling a wide range of advanced assembly requirements. Our capabilities include:

• SMT and through-hole
• High speed placement
• BGA and Micro-BGA
• 0.3mm fine pitch IC's
• 01005 placement
• AOI board inspection
• Customized reflow profiling
• Prototype quick-turn assembly
• Production volumes with scheduled deliveries
• Double side boards
• Conformal coating
• Firmware programming
• Functional testing
• RoHS compliant process
• IPC certified
• Workmanship guarantee

See something you need that's not on this list? Get in touch!