Board
Review your PCB configuration and understand CircuitHub's fabrication capabilities and requirements.
Board capabilities8
StackupsHow CircuitHub's standard and custom PCB stackups work, including dielectric constants, solder mask parameters, and impedance control.Fabrication capabilities & design rulesStandard design rules, stackups, and how to request custom fabrication requirements such as castellated edges or impedance control.Maximum allowed board dimensionsExplains the board size limits for instant online quoting versus manual quote review.Minimum solder mask dam (sliver)CircuitHub's minimum solder mask dam (sliver) specification is 4 mil (0.1mm).Solder mask expansionCircuitHub's recommended minimum solder mask expansion and sliver width between copper pads.Minimum hole-to-hole drill clearanceThe minimum hole-to-hole drill clearance for vias and plated through holes.Silkscreen to solder mask limitationCircuitHub clips silkscreen to a 2 mil (0.05mm) clearance from solder mask.Flex boardsflex pcbs, rigid flex
Board specifications9
Via in padHow to specify filled vias in pads, such as on a BGA, and how to request conductive via fill.Specifying impedance controlHow to specify impedance control requirements in the Board tab of your project page.Board finishChoose between ENIG and ENEPIG surface finishes for your PCB.Blind/Buried holesHow to correctly specify the number of blind/buried layer sets on your project page to get an accurate quote.Board cutView your PCB board cut on the platform after uploadSupported core substrates and materialsCore substrates, materialsPanelization MethodHow to specify what type of panelization methodUL markings on boardsUL markingsSpecs for slotted through-hole padsAnnular ring and minimum slot width requirements for plated, slotted through-hole pads.