Via in pad
How to specify filled vias in pads, such as on a BGA, and how to request conductive via fill.
If your board contains vias in pads which need to be filled, such as on a BGA, be sure to select the option which indicates this on the board view. These will be filled with non-conductive resin and plated flat at the surface.
If however conductive via fill is required. This must be added to the 'Custom Requirements' section to be manually quoted.